Product Features: :
BGA IC adhesive removing liquid
Not contain any Benzene Coderivative substances which causes leukaemia
Softens and removes resination & sealing glue of chip BGA IC of mobile phones
The ingredients is newest, environmental protection and safest
Quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon
Does not harm to circuit board and component
Gross weight: 96g
Package size: 38 x 38 x 90mm (L x W x H)
--It shall not touch eyes and skins. If it is touched by accident, use a lot of clean water to wash.
--When finished, it should be sealed with a cap to avoid volatilizing which make the effect not good.
--Be carful to open to since there is pressure
* 1 x BGA IC adhesive removing liquid