30ml BGA IC Adhesive Removing Liquid for Circuit Board Component CTL-26988

30ml BGA IC Adhesive Removing Liquid for Circuit Board Component CTL-26988

US$ 9.01 Free worldwide shipping!
TinyDeal
Product Features: : BGA IC adhesive removing liquid Not contain any Benzene Coderivative substances which causes leukaemia Softens and removes resination & sealing glue of chip BGA IC of mobile phones The ingredients is newest, environmental protection and safest Good permeability Quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon Does not harm to circuit board and component Volume: 30ml Gross weight: 96g Package size: 38 x 38 x 90mm (L x W x H) Note: --It shall not touch eyes and skins. If it is touched by accident, use a lot of clean water to wash. --When finished, it should be sealed with a cap to avoid volatilizing which make the effect not good. --Be carful to open to since there is pressure Product Specifications:: Package Contents:: * 1 x BGA IC adhesive removing liquid